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METAPLAST CIRCUITS LIMITED 416-285-5000
MICRO VIA TECHNOLOGY
16 Layer, uVia holes 1-2 & 15-18 buried vias 2-15, .080″ Thick, Class 3, ENiG Finish
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Products
Multilayer Boards (from 4-60 layers)
Flex & Rigid-Flex Circuits
Hybrid Boards
RF & Microwave Boards
Thermal Metal Backed Boards
Sequential Lamination
Micro Via Technology
Oversized PCB's
