TECHNOLOGY ROAD MAP
Standard Features
| Standard Capabilities | Advanced Capabilities | |
|---|---|---|
| Inner Layer Trace/Space | .003”/.003” | .002”/.002” |
| External Layer Trace/Space | .003”/.003” | .002”/.002” |
| Pad over Drill Size for Tangency | .008” | 006” |
| Antipad over Drill | .020” | .016” |
| Min Mechanical Drill Size | .008” | .006” |
| Maximum Panel Size | 18” x 24” | 30” x 36” |
| Min Core Thickness | .002” (rigid), .001” (flex) | .002” (rigid), .001” (flex) |
| Maximum Copper Weight | 4 oz | 6 oz |
| Minimum Copper Weight | ¼ oz | ¼ oz |
| Maximum Aspect Ratio |
Hole > .020″ = 20:1 Hole < .020″ = 16:1 |
Hole > .020″ = 23:1
Hole < .020″ = 18:1 |
| Maximum Layer Count | 42 | > 42… |
| Minimum PCB Thickness | .010” (rigid), .001” (flex) | .008” (rigid), .001” (flex) |
| Solder Mask Registration | +/- .002” | +/- .0015” |
Other
| Standard Capabilities | Advanced Capabilities | |
|---|---|---|
| Buried Core Vias | Y | Y |
| Sequential Lamination | Y | Y |
| Impedance | Y | Y |
| Single – Ended | +/- 10% | +/- 5% |
| Differential Edge Coupled | +/- 10% | +/- 5% |
| Differential Broadside | +/- 10% | +/- 5% |
| Single-Ended & Differential layer | +/- 10% | +/- 5% |
| Chip Cavity | Y | Y |
| Mixed Dielectrics | Y | Y |
| Conductive, Non-conductive Hole Fill | Y | Y |
| Metal Core (Al, Cu) | Y | Y |
| Depth Control Drill/Rout | Y | Y |
| Thermagon with Insulated Metal Core | Y | Y |
| CNC Milling | Y | Y |
| Copper Invar Copper | Y | Y |
| Countersinks, Edge Milling | Y | Y |
| Zincate Plating Process | Y | Y |
Quality Systems & Electrical Tests
| Standard Capabilities | Advanced Capabilities | |
|---|---|---|
| CAD Net List Testing, IPC-356 | Y | Y |
| Standard SMT Pitch | .016″ | .016″ |
| Flying Probe Min Pitch | .004″ | .004″ |
| Continuity Resistance: 5 ohms | Y | Y |
| Isolation Resistance: 100 mega ohms | Y | Y |
| Hi-Pot Testing: 1000V | Y | Y |
| ISO 9001:2008 | Y | Y |
| MIL-PRF-55110 | Y | Y |
| UL796 | Y | Y |
| ITAR | Y | Y |
| CGRP | Y | Y |
| NADCAP | Y | Y |